Capacitive pressure sensor
US7191661B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2005 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | Jul 10, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0073
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A capacitive pressure sensor made up of two silicon on insulator (SOI) wafers lying opposite of each other and joined to each other in a vacuum-tight manner, a recess being formed between the two wafers. The first wafer exclusively supports the evaluation circuits required for measuring the applied pressure and a capacitive electrode, and the second wafer has a recess formed by surface micromechanics processes, in which the counter electrode to the capacitive electrode of the first wafer is situated. The second wafer at the same time forms a cover for the first wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.