Thermal management system
US7191858B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2002 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | Dec 18, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T90/40
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A thermal management system has a high temperature heat transfer circuit and a low temperature heat transfer circuit for modulating the temperature of heat-generating components having different operating temperatures. The heat transfer circuits are in flow communication and are interdependent so that a single circulating pump can be used to pump a liquid heat transfer medium through both circuits. One of the heat transfer circuits comprises a continuous loop and the other heat transfer circuit comprises an open loop having a first end and a second end at which it is in flow communication with the first heat transfer circuit. Each heat transfer circuit is provided with a heat exchanger to modulate temperature of the heat transfer medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.