Methods for fabricating microstructures by imaging a radiation sensitive layer sandwiched between outer layers
US7192692B2 · kind B2 · utility
35Cited by
18References
34Claims
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Key dates
| Filing date | Sep 11, 2003 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | Dec 7, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Microstructures are fabricated by imaging a microstructure master blank that includes a radiation sensitive layer sandwiched between a pair of outer layers, on an imaging platform, to define the microstructures in the radiation sensitive layer. At least one of the outer layers is then removed. The microstructures that were defined in the radiation sensitive layer are developed. The radiation sensitive layer sandwiched between the pair of outer layers may be fabricated as webs, to provide microstructure master blanks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.