Method for manufacturing micro-structural unit
US7192879B2 · kind B2 · utility
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2References
16Claims
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Key dates
| Filing date | Aug 22, 2005 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | Aug 22, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/04
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for manufacturing a micro-structural unit is provided. By the method, micro-machining is performed on a material substrate including first through third conductive layers and two insulating layers, one of which is interposed between the first and the second conductive layers, and the other between the second and the third conductive layers. The method includes several etching steps performed on the layers of the material substrate that are different in thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.