High precision, rapid laser hole drilling
US7193175B1 · kind B1 · utility
4Cited by
5References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2005 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | Mar 5, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser system produces a first laser beam for rapidly removing the bulk of material in an area to form a ragged hole. The laser system produces a second laser beam for accurately cleaning up the ragged hole so that the final hole has dimensions of high precision.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.