Intermediate chip module, semiconductor device, circuit board, and electronic device
US7193308B2 · kind B2 · utility
305Cited by
4References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 22, 2004 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | Feb 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An intermediate chip for electrically connecting semiconductor chips includes: a substrate having a first side and a second side; a trans-substrate conductive plug which projects to the first side of the substrate; a post electrode which is displaced from the trans-substrate conductive plug in plan view on the second side of the substrate; and wiring which is disposed in or on the substrate for coupling the trans-substrate conductive plug and the post electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.