Thin film bulk acoustic wave sensor suite
US7193352B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2005 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | Sep 9, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/0427
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Thin film bulk acoustic wave sensors with coatings of biological and chemical materials, multiple electrode depositions and a piezo-active thin film transducer layer are hosted on a substrate. The thin film bulk acoustic wave sensor suite, or T-BASS, produces a low-voltage, IC-compliant thickness-directed electric field that is substantially uniform over a substantial portion of the active area of the BAW structure. The BAWs produced are essentially extensional plane waves propagating away from the substrate surface and having phase progression substantially oblique to the substrate surface. For BAW applications requiring sensing by an active layer, it would be most desirable to have an electrode structure that is both IC-compliant and can be energized from a low-voltage source of electrical energy. The thin film BAW sensors are compatible with IC fabrication and processing techniques, such as photolithography. Both single channel and multiple channel thin film bulk acoustic wave sensors are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.