Method of producing temperature sensor and mounting same to a circuit board
US7193498B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2006 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | May 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C1/1413
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Temperature sensors are produced by first producing temperature sensing elements each having electrodes on its mutually oppositely facing main surfaces, next forming a lead frame comprising a linearly elongated base part and a plurality of pairs of planar lead parts extending perpendicularly from said base part, twisting each of these planar lead parts such that each of the pairs has top end parts which face each other with a gap therebetween, inserting one of the temperature sensing elements between the mutually facing top end parts of each pair in the corresponding gap and electrically connecting the electrodes on the inserted temperature sensing element individually to the top end parts of the corresponding pair, and cutting each of the planar lead parts from said base part to form lead terminals of specified lengths for the temperature sensors. Each of the planar lead parts is provided with a semicircular kinked part distal from the top end part such that the kinked parts of each of the pairs of planar lead parts are bent in a same direction with respect to each other and in a side-by-side relationship.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.