Heat dissipating device
US7193849B2 · kind B2 · utility
20Cited by
10References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 27, 2004 |
| Grant date | Mar 20, 2007 |
| Priority date | — |
| Expiry date | Oct 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.