Patent · US Active

Process, apparatus and slurry for wire sawing

US7195542B2 · kind B2 · utility

2Cited by

5References

25Claims

0Family size

Assignee

FREIBERGER COMPOUND MATERIALS GMBH · DE

Inventors

Ralf Hammer · Freiberg, DE
André Kleinwechter · Freiberg, DE
Sylvia Müller · Freiberg, DE
Ralf Gruszynsky · Brand-Erbisdorf, DE

Key dates

Filing date	Jul 12, 2006
Grant date	Mar 27, 2007
Priority date	—
Expiry date	Jul 12, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T83/9292
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A wire saw (1; 100) for cutting a workpiece includes a device (21, 22, 24, 27) for setting, controlling and/or maintaining a predetermined or desired water content in at least part of the gaseous medium that contacts the slurry. With the wire saw according to the invention and the process carried out using this wire saw, it is possible to achieve consistently good surface properties of the resulting wafers over a prolonged period of use of a slurry.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.