Patent · US Expired

Process and device for the manufacture of a primary unit pack of a wafer

US7195688B2 · kind B2 · utility

0Cited by

4References

7Claims

0Family size

Assignee

LTS Lohmann Therapie-Systeme AG · DE

Inventors

Wolfgang Schafer · Düren, DE
Ronald Hackbarth · Koblenz, DE
Hans-Dieter Sahm · Ingelbach, DE

Key dates

Filing date	Sep 6, 2003
Grant date	Mar 27, 2007
Priority date	—
Expiry date	Sep 6, 2023

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1744
WIPO fieldHandling
WIPO sectorMechanical engineering

Abstract

A process and device for manufacturing a primary unit pack of a wafer. A laminate comprising a carrier sheet and an active substance film is cross-cut at a predetermined length, detached from the carrier sheet, guided between two packaging material webs and, conveyed to a sealing station along with the packaging material webs. The packaging material webs are sealed to form a bag that is separated from the webs. The process includes detaching the carrier sheet from the active substance film, pulling the carrier sheet forward over the predetermined length of the wafer, simultaneously guiding the active substance film, which has been detached from the carrier sheet, without mechanical stress, the front end being between the packaging material webs which are in a resting condition, and is received and fixed by packaging material webs and transversely cut to form a wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.