Tin alloy electroplating system
US7195702B2 · kind B2 · utility
27Cited by
16References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2003 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Mar 2, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The selective membrane prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment. A conduit may be employed in the electrochemical cell to permit one way flow of anolyte to the catholyte compartment thereby replenishing tin to the catholyte compartment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.