Method for manufacturing quartz oscillator
US7195715B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 26, 2004 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Sep 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H3/04
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing quartz oscillators is provided which permits quartz oscillators having an oscillation frequency, as designed, to be obtained with small variation of individual oscillation frequency and with high reliability. The method for manufacturing quartz oscillators according to the present invention comprises the steps of forming a first resist layer (300) on one surface of a quartz substrate (100), exposing said first resist layer to light of a first amount of exposure to form a patterned first masking layer (210), forming a second resist layer (400) on the other surface of said quartz substrate, exposing said second resist layer to light of a second amount of exposure via said quartz substrate to form a patterned second masking layer (410) by using said first masking layer, and etching said quartz substrate to form quartz pieces (150) by using said patterned first masking layer and said patterned second masking layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.