Composite patterning devices for soft lithography
US7195733B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2005 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Nov 5, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2111/00181
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.