Light emitting diode module with high heat dissipation
US7196358B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 25, 2005 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Nov 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light emitting diode with high heat dissipation includes a substrate, a LED chip, a metal light reflection layer, a first lens, a holder, and a second lens. The substrate has an upper surface formed with a positive electrode and an opposite electrode, and a lower surface opposite to the upper surface. The LED chip is arranged on the upper surface of the substrate, and is electrically connected to the positive electrode and the opposite electrode by wires. The metal light reflection layer is located on the upper surface of the substrate for surrounding the LED chip, and reflecting the light emitted from the LED chip. The first lens is mounted on the metal light reflection layer for encapsulating the LED chip. The holder is mounted on the substrate to cover the first lens. And the second lens arranged on the holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.