Microstructure comprising a surface which is functionalized through the localized deposit of a thin layer and production method thereof
US7196385B2 · kind B2 · utility
3Cited by
6References
44Claims
0Family size
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Key dates
| Filing date | Aug 25, 2003 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Aug 25, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/733
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electromechanical microstructure including a first mechanical part formed in a first electrically conductive material, and which includes a zone deformable in an elastic manner having a thickness value and an exposed surface, and a first organic film having a thickness, present on all of the exposed surface of the deformable zone. The thickness of the first film is such that the elastic response of the deformable zone equipped with the first film does not change by more than 5% compared to the response of the bare deformable zone, or the thickness of the first film is less than ten times the thickness of the deformable zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.