Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
US7196418B2 · kind B2 · utility
9Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2005 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Jan 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element having a plurality of electrodes provided on one principal surface thereof and a wiring substrate having a conductive layer on an insulating substrate. The wiring substrate is arranged in a substantially U-shape along an outer edge of the semiconductor element. An end of the conductive layer of the wiring substrate is connected to the electrodes of the semiconductor element. The other end of the conductive layer extends in a direction opposite to the semiconductor element on the other principal surface side of the semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.