Light emitting assembly with heat dissipating support
US7196459B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2003 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Dec 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2054
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light emitting assembly includes a metal substrate for dissipating heat from the assembly. The metal substrate includes an electrically insulating layer or coating on at least one side. Circuit traces are applied to the electrically insulating layer using either thick or thin film techniques. At least the ends of the circuit traces include a metallic section to which leads of light emitting elements are soldered or wire-bonded. A metallic section is provided adjacent the light emitting element to transfer heat to the underlying substrate and/or to reflect light from the element away from the substrate. A clear finish retards tarnishing of the reflecting metallic section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.