Optical printed circuit board for long-distance signal transmission
US7197202B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2003 |
| Grant date | Mar 27, 2007 |
| Priority date | — |
| Expiry date | Oct 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0274
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an optical printed circuit board (PCB) for long-distance signal transmission, which is combined with fiber blocks and pipe blocks embedded in opto-via holes to form a multi-layered optical PCB, and transmits an optical signal using a fiber ribbon when an optical signal transmission distance between layers constituting the multi-layered optical PCB is longer than a length of an optical waveguide element used in conjunction with a silicon substrate. The optical PCB comprises a base substrate including an insulating material, a copper foil, and an opto-via hole, and an optical signal transmission member attached to the base substrate to horizontally transmit an optical signal. An optical signal connection member is horizontally connected to the optical signal transmission member to transmit the optical signal across a desired distance. Therefore, an optical PCB of the present invention is advantageous in that an optical waveguide, a pipe block, and a fiber block are horizontally and optionally arranged and attached to each other, thereby transmitting an optical signal across a longer distance than a length of a silicone substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.