Finned device for removing heat from an electronic component
US7198094B2 · kind B2 · utility
24Cited by
14References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2003 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Jun 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriented at an angle with respect to several flow streams of the fluid medium across the fins. Each flow stream follows a unique direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.