Providing a surface layer or structure on a substrate
US7198826B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2004 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Mar 6, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y10/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method of providing a surface layer or structure on a substrate. The method includes ink jet printing spaced first segments of the surface layer or structure material on the substrate and drying or curing the first segments. Additionally, the method includes ink jet printing further material segments in the gaps between the first segments and drying or curing the further segments. In the present invention, the material and/or curing and drying conditions are different in both steps of the method. The method also includes forming a surface layer or structure where segment material and/or curing and drying conditions are chosen so as to control mechanical properties of the surface layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.