Heat stable photocurable resin composition for dry film resist
US7198884B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2003 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Aug 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to a process for preparing a dry film resist by forming a photocurable resin composition onto a support film with a thickness of 1 to 50 μm and optionally laminate a protective film onto the photocurable composition layer to obtain a dry film resist; whereby the photocurable resin is formed from a homogeneous mixture comprising (a) from 20–90 wt % of an alkaline soluble binder oligomer or polymer; (b) from 5 to 60 wt % of one or more photopolymerizable monomers which are compatible with the oligomers and polymers of component (a); (c) from 0.01 to 20% by weight of one or more photoinitiators; (d) from 0 to 20% by weight of additives and/or assistants; and (e) from 0.1 to 10% by weight of a leuco triphenylmethane dye of the formula (I), wherein R1 is a residue selected from (II), R2 is C1–C12 alkyl or phenyl which may be mono-, di- or tri-substituted by C1–C6 alkyl, trifluoromethyl, C1-6 alkoxy, C1-6 alkylthio, halogen and nitro; R3 is hydrogen or C1–C12 alkyl; R4 to R9 independently of one another are hydrogen or C1–C12 alkyl; X is O, S, NH or N—C1–C12-alkyl; (a) to (e) being 100% by weight. The above composition is useful to avoid unfavourable colour generati…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.