Overmolded semiconductor package with an integrated EMI and RFI shield
US7198987B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2004 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Mar 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one exemplary embodiment, an overmolded package comprises a semiconductor die situated on a substrate. The overmolded package further comprises an overmold situated over the semiconductor die and the substrate, where the overmold has a top surface. The overmolded package further comprises a conductive layer situated on the top surface of the overmold, where the conductive layer comprises a conductive polymer, and where the conductive layer forms an EMI and RFI shield. According to this exemplary embodiment, the overmolded package can further comprise a post situated over the substrate, where the post is connected to the conductive layer. The overmolded package can further comprise a hole situated in the overmold, where the hole is situated over the post, where the hole is filled with the conductive polymer, and where the conductive polymer is in contact with the post.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.