Interconnect junction providing reduced current crowding and method of manufacturing same
US7199035B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2004 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Nov 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are a junction where electrical interconnects on a semiconductor substrate intersect and a method of manufacturing a junction where electrical interconnects on a semiconductor substrate intersect is disclosed. In one embodiment, the junction includes a portion of at least one current providing electrical interconnect having a length parallel to a longitudinal axis thereof and configured to provide a flow of electrical current. In addition, the junction includes a portion of at least one current receiving electrical interconnect having a length parallel to a longitudinal axis thereof and configured to intersect with the at least one current providing interconnect at the junction in order to receive the flow of electrical current from the at least one current providing interconnect. Also, in such an embodiment, the junction includes at least one current directing feature positioned between the current providing and current receiving interconnects, and oriented substantially non-perpendicular to the longitudinal axis of the at least one current providing interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.