Interconnect routing over semiconductor for editing through the back side of an integrated circuit
US7199039B2 · kind B2 · utility
0Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2003 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Apr 10, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Circuit edits may be performed through the back side of an integrated circuit die. In one embodiment, a circuit edit is achieved by exposing first and second circuit edit connection targets through a semiconductor substrate of the integrated circuit die from the back side. An insulating layer is not deposited over the first and second circuit edit connection targets and the exposed semiconductor substrate. Next, a conductor is deposited over the circuit edit connection targets from the back side of the integrated circuit to couple together the circuit edit connection targets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.