Carbon-phenol resin molding compound
US7199186B2 · kind B2 · utility
1Cited by
1References
10Claims
0Family size
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Key dates
| Filing date | Aug 5, 2002 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Feb 2, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A carbon-phenol resin molding compound is provided, which is preferably used to obtain molded articles having high electrical and thermal conductivities as well as good mechanical strength. The resin molding compound is prepared by reacting a phenol with an aldehyde in the presence of a catalyst, while mixing them with a carbon powder such that a content of the carbon powder in the molding compound is 75 wt % or more. The catalyst is at least one selected from tertiary amines, carbonates, hydroxides and oxides of alkali metals or alkali earth metals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.