Stacked electrical resistor pad for optical fiber attachment
US7199446B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2003 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Sep 4, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4238
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad. The fiber is disposed along a second axis in the region of the bond pad where the second axis is at a non-zero angle (possibly, but not necessarily a right angle) with respect to the first axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.