Patent · US Expired

Surface-mountable semiconductor component and method for producing it

US7199470B2 · kind B2 · utility

5Cited by

9References

29Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Georg Bogner · Lappersdorf, DE
Jörg Erich Sorg · Regensburg, DE
Gunter Waitl · Regensburg, DE

Key dates

Filing date	Jan 31, 2005
Grant date	Apr 3, 2007
Priority date	—
Expiry date	Jan 31, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip (1), and an encapsulation material (50). The two external electrical connections are arranged at a film (2) having a thickness of less than or equal to 100 μm. The semiconductor chip (1) is fixed at a first main surface (22) of the film (2) and the encapsulation material (50) is applied on the first surface (22).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.