Semiconductor copper bond pad surface protection
US7199475B2 · kind B2 · utility
2Cited by
14References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2005 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Apr 14, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.