Multilayered structure and method of manufacturing the same, and ultrasonic transducer
US7199509B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2005 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | May 5, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A multilayered structure which includes insulating layers and electrode layers and can be easily arrayed. The multilayered structure is manufactured by using a substrate on which first and second groups of columnar structures are arranged in a predetermined arrangement, and includes: a first electrode layer formed by forming a film of a conducting material on the substrate or an insulating layer except for portions around the first group of columnar structures; an insulating layer formed by spraying powder of an insulating material on the first electrode layer to deposit the powder thereon; a second electrode layer formed by forming a film of a conducting material on the insulating layer except for portions around the second group of columnar structures; and interconnections formed by filing, with a conducting material, holes formed by removing the columnar structures from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.