Burn-in substrate for semiconductor devices
US7199598B2 · kind B2 · utility
1Cited by
3References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 28, 2004 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Jan 12, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Input and output of small-current signals between a mother board and semiconductor devices subjected to a burn-in test are made via a device driving unit. Large-current main power is supplied via the device driving unit through bus bars without passing through the mother board. In this way, the risk of burn-out in a burn-in substrate and burn-in sockets, and damages caused by a burn-out can be reduced even when it occurs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.