Optically enabled hybrid semiconductor package
US7200295B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2004 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Aug 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81801
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.