Method for fabricating optical devices by assembling multiple wafers containing planar optical waveguides
US7200303B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Aug 31, 2005 |
| Grant date | Apr 3, 2007 |
| Priority date | — |
| Expiry date | Aug 31, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/2308
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical device comprises a first substrate wafer with at least one buried optical waveguide on an approximately flat planar surface of the substrate and a second substrate wafer with at least a second buried optical waveguide. The waveguides so formed may be straight or curved along the surface of the wafer or curved by burying the waveguide at varying depth along its length. The second wafer is turned (flipped) and bonded to the first wafer in such a manner that the waveguides, for example, may form an optical coupler or may cross over one another and be in proximate relationship along a region of each. As a result, three dimensional optical devices are formed avoiding the convention techniques of layering on a single substrate wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.