Apparatus for providing a substrate with viscous medium
US7201802B2 · kind B2 · utility
6Cited by
28References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2001 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Dec 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Solder paste application, inspection and correction. Following or during application of solder paste on a substrate, the result thereof is inspected and any detected errors are registered. Following an evaluation as to whether correction of these errors is required and if it would be worthwhile, the errors are corrected. The correction involves removing solder paste from locations where so required, and jetting of additional solder paste to locations where so required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.