High throughput plasma treatment system
US7201823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2004 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Sep 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01078
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for the plasma treatment of parts. The method includes sending loading signals from an electronic control to a transfer mechanism and loading the parts from a position outside of the treatment chamber to a plurality of treatment positions within the treatment chamber based on the loading signals. A plasma is generated within the treatment chamber to treat the parts. After treatment, unloading signals are sent from the electronic control to the transfer mechanism and the parts are unloaded from the treatment chamber based on the unloading signals. Each of the parts may be guided to a corresponding one of the treatment positions during loading.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.