Process for producing an integrated electronic circuit comprising superposed components and integrated electronic circuit thus obtained
US7202137B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2004 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Jul 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing an integrated electronic circuit. The process begins with the production of a first electronic component and a second electronic component that are superposed on top of a substrate. A volume of temporary material is formed on the substrate at the position of the second electronic component. The first electronic component is then produced above the volume of temporary material relative to the substrate, and then the second electronic component is produced using at least one shaft for access to the temporary material. The first electronic component may be an active component and the second electronic component may be a passive component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.