Micro-fluid ejection head containing reentrant fluid feed slots
US7202178B2 · kind B2 · utility
0Cited by
11References
16Claims
0Family size
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Key dates
| Filing date | Dec 1, 2004 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Jun 7, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/162
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of micro-machining a semiconductor substrate to form through slots therein and substrates made by the method. The method includes providing a dry etching chamber having a platen for holding a semiconductor substrate. During an etching cycle of a dry etch process for the semiconductor substrate, a source power is decreased, a chamber pressure is decreased from a first pressure to a second pressure, and a platen power is increased from a first power to a second power. Through slots in the substrate provided by the method can have a reentrant profile for fluid flow therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.