Anhydride polymers for use as curing agents in epoxy resin-based underfill material
US7202304B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2006 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Mar 8, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.