High power light-emitting diode package and methods for making same
US7202505B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2005 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Apr 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
Abstract
In a light-emitting diode package made in accordance with the present invention, a light-emitting diode assembly is positioned above a spacer assembly. In the light-emitting diode assembly, a die containing a light-emitting diode is positioned above a substrate. During operation, both the combination of at least one conductive plate adjacent to the die and a plurality of castellated side holes positioned on sides of the substrate, and a substrate thermal via positioned beneath the die, conduct thermal energy from the die to a light-emitting diode assembly pad on which the substrate is mounted. The light-emitting diode assembly pad conducts thermal energy to a top pad of the spacer assembly. A plurality of castellated side holes formed in sides of a spacer of the spacer assembly and a plurality of thermal vias positioned within the spacer conduct thermal energy from the top pad of the spacer assembly to a base pad of the spacer assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.