Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
US7202553B2 · kind B2 · utility
4Cited by
3References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 15, 2004 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Oct 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for forming device packages includes forming a perimeter with a reactive foil and a bonding material interposed between a first wafer and a second wafer, pressing the first and the second wafers against the reactive foil and the bonding material, initiating the reactive foil, wherein the reactive foil heats the bonding material to create a bond between the first and the second wafers, and singulating the first and the second wafers into the device packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.