Substrate inspection device and substrate inspecting method
US7202690B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2005 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Jul 15, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A laser beam irradiation unit irradiates a laser beam on a top surface pattern portion of a wiring to be inspected among plural wirings formed on a substrate, with an intensity high enough to cause laser abrasion or two-photon absorption at the irradiated portion. A D.C. power supply applies, via an ammeter, a predetermined voltage between an electrode portion that traps electrons released from the top surface portion and a contact prove pressed against a bottom surface pattern of the wiring. An open circuit state and a short-circuit state of the wiring are judged using a current value measured in the ammeter. It is thus possible to inspect a wiring for an open circuit and a short-circuit easily without bringing a probe into contact with the lands of wirings on a top surface of the substrate to be inspected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.