Thermal interconnection for capacitor systems
US7203056B2 · kind B2 · utility
17Cited by
9References
35Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 7, 2004 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Dec 22, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/70
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Thermal protection is provided in systems utilizing high-current double-layer capacitors. For example, in one implementation, an interconnection coupled to at least one double-layer capacitor that carries capacitor current to or from the at least one double-layer capacitor is functionally coupled to the at least one double-layer capacitor to reduce a temperature of the capacitor is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.