Micro mirror arrays and microstructures with solderable connection sites

US7203394B2 · kind B2 · utility

Assignee

• Rosemount Aerospace Inc. · US

Inventors

• Thomas G. Wiegele · Apple Valley, US
• Christopher Apanius · Moreland Hills, US
• Kenneth G. Goldman · Olmsted Falls, US
• Shuwen Guo · Lakeville, US
• Loren E. St. Clair · Apple Valley, US
• Timothy R. O'Meara · Burnsville, US
• James J. Pohl · Apple Valley, US

Key dates

• Filing date: Jul 15, 2003
• Grant date: Apr 10, 2007
• Expiry date: Sep 13, 2023

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2201/042
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A micro mirror array including an upper wafer portion having a plurality of movable reflective surfaces located thereon, the upper wafer portion defining a coverage area in top view. The array further includes a lower wafer portion located generally below and coupled to the upper wafer portion. The lower wafer portion includes at least one connection site located thereon, the at least one connection site being electrically or operatively coupled to at least one component which can control the movement of at least one of the reflective surfaces. The at least one connection site is not generally located within the coverage area of the upper wafer portion.