Techniques for microchannel cooling
US7204298B2 · kind B2 · utility
59Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Mar 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device is provided. The heat-transfer device comprises one or more microchannels suitable for containing a heat-transfer fluid, one or more of the microchannels having protruding structures on at least one inner surface thereof configured to affect flow of the heat-transfer fluid through the one or more microchannels. The structures may comprise posts coated with a hydrophobic coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.