Modular mold
US7204685B1 · kind B1 · utility
23Cited by
71References
61Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2004 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Oct 27, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2679
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold of the present invention is capable of modular configuration and reconfiguration for producing molded objects. Many of the same mold components are reusable in the mold to increase the flexibility of the mold and reduce expense associated with molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.