Apparatus and method for mechanically bonding and cutting an article
US7204899B2 · kind B2 · utility
7Cited by
28References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2003 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Apr 16, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1741
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In a method and apparatus for mechanically bonding and cutting an article during assembly thereof at least a portion of the article is transported through a nip defined by first and second members. A bonding segment is disposed on one of the first and second members and a cutting segment separate from the bonding segment is also disposed on one of the first and second members. The apparatus is operable so that a portion of the article is mechanically bonded as the article passes through the nip and a portion of the article separate from the bonded portion is cut as the article passes through the nip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.