Method of providing cured coating films free of popping defects
US7205029B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Sep 30, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/205
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method for providing cured coating films free of popping defects. The method requires the application to a substrate of at least 2.0 mils/50.8 microns of a uncured curable coating composition comprising an anti-popping component (a), a film-forming component (b), and a crosslinking component (c), wherein anti-popping component (a) has from 12 to 72 carbon atoms, is substantially free of any heteroatoms, is not a crystalline solid at room temperature and comprises a mixture of two or more structures selected from the group consisting of aliphatic structures for anti-popping component (a), aromatic-containing structures for anti-popping component (a), cycloaliphatic-containing structures for anti-popping component (a), and mixtures thereof, at least one of the two or more structures being a cycloaliphatic-containing structure or an aromatic-containing structure. The coated uncured substrate is cured to provide a cured film free of popping defects with an average film build of at least 2.0 mils/50.8 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.