Laser machining method and laser machining apparatus
US7205501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2004 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Aug 27, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.