Silicon building blocks in integrated circuit packaging
US7205638B2 · kind B2 · utility
1Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2004 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Aug 31, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved silicon building block is disclosed. In an embodiment, the silicon building block has at least two vias through it. The silicon building block is doped and the vias filled with a first material, and, optionally, selected ones of the vias filled instead with a second material. In an alternative embodiment, regions of the silicon building block have metal deposited on them.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.