Stray field shielding structure for semiconductors
US7205643B2 · kind B2 · utility
1Cited by
1References
7Claims
0Family size
Inventor
Key dates
| Filing date | Mar 8, 2005 |
| Grant date | Apr 17, 2007 |
| Priority date | — |
| Expiry date | Jul 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stray field shielding structure for die attaching onto a magnetic random access memory chip or to other chips to prevent loss of memory due to magnetic fields or radiation is made by a method which provides a thick layer of magnetic material which is precise in its dimensions and adapted for placement on individual die by existing pick and place machines and die attach bonders. The magnetic shielding material is cut to a desired size by etching to remove all burrs and debris and is then attached only to good die using a die attach film of thermoset plastic or a gob of epoxy adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.